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XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

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XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

Name: XCVU1251FLVB1760I 750 IO Xilinx FPGA Chip
Brand: Xilinx Inc.
Price: 20000 USD

Brand Name : Xilinx Inc.

Model Number : XCVU125-1FLVB1760I

Certification : Lead free / RoHS Compliant

MOQ : 1 pcs

Price : USD 20000~26000 pcs

Payment Terms : T/T, Western Union, Paypal, Trade Assurance, Credit Card

Supply Ability : 65 pcs

Delivery Time : 3-5 Day

Packaging Details : International Standard Packaging

Category : Programmable Logic ICs

Condition : Original 100%,Brand New and Original,New

Number of I/Os : 750 I/O

Product : Virtex UltraScale

Package / Case : FBGA-2104

Distributed RAM : 9.7 Mbit

Embedded Block RAM - EBR : 88.6 Mbit

Data Rate : 30.5 Gb/s

Service : BOM Kitting

Lead time : In Stock,contact us

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XCVU125-1FLVB1760I Xilinx FPGA Chip FBGA-1760 Virtex UltraScale

Product Attribute	Attribute Value
Manufacturer:	Xilinx
Product Category:	FPGA - Field Programmable Gate Array
Product:	Virtex UltraScale
Number of Logic Elements:	1566600
Number of I/Os:	750 I/O
Operating Supply Voltage:	0.85 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 100 C
Mounting Style:	SMD/SMT
Package / Case:	FBGA-1760
Data Rate:	30.5 Gb/s
Series:	XCVU125
Brand:	Xilinx
Distributed RAM:	9.7 Mbit
Embedded Block RAM - EBR:	88.6 Mbit
Moisture Sensitive:	Yes
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	1
Subcategory:	Programmable Logic ICs
Tradename:	Virtex UltraScale

Summary

Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI
technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and
application requirements through integration of various system-level functions.

Virtex UltraScale+ HBM devices incorporate 4GB or 8GB HBM stacks adjacent to the FPGA die. Using
stacked silicon interconnect technology, the FPGA communicates to the HBM stacks through memory
controllers that connect to dedicated low-inductance interconnect in the silicon interposer. Each Virtex
UltraScale+ HBM FPGA contains one or two HBM stacks, resulting in up to 16GB of HBM per FPGA.
The FPGA has 32 HBM AXI interfaces used to communicate with the HBM. Through a built-in switch
mechanism, any of the 32 HBM AXI interfaces can access any memory address on either one or both of the
HBM stacks due to the flexible addressing feature. This flexible connection between the FPGA and the
HBM stacks results in easy floorplanning and timing closure. The memory controllers perform read and
write reordering to improve bus efficiency. Data integrity is ensured through error checking and correction
(ECC) circuitry.

XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

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XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip Images

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XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip

XCVU125-1FLVB1760I Virtex UltraScale

750 I/O Xilinx FPGA Chip

750 I/O Virtex UltraScale

XCVU125-1FLVB1760I 750 I/O Xilinx FPGA Chip Images